Thursday, December 04, 2014

Critical factors affecting the 3D microstructural formation in hybrid conductive adhesive materials studied by X-ray nano-tomography




Nanoscale , 2015, Advance Article

DOI: 10.1039/C4NR06068G, Communication

Yu-chen Karen Chen-Wiegart, Miriam Aileen Figueroa-Santos, Stanislas Petrash, Jose Garcia-Miralles, Jun Wang

X-ray nano-tomography reveals 3D characters in hybrid conductive adhesives, which are favorable in a wide range of applications, including a lead-free solder in micro-chips, and in electronics and energy storage devices.

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